Name: Heat Transfer CPU Thermal Pad With 3.2W/MK Thermal Conductive Gap Pad Suitable For Portable Electronics And Industrial Equipment
Brand: Dongguan Ziitek Electronical Material and Technology Ltd.
SKU: Cuscinetto termico TIF100-32-05S
Price: 4.10 USD
Availability: InStock

Casa Prodotti Cuscinetto termico del CPU

Heat Transfer CPU Thermal Pad With 3.2W/MK Thermal Conductive Gap Pad Suitable For Portable Electronics And Industrial Equipment

Dettagli:

Luogo di origine:	Cina
Marca:	Ziitek
Certificazione:	UL and RoHs
Numero di modello:	Cuscinetto termico TIF100-32-05S
Documento:	TIF100-32-05S_Data Sheet.pdf

Termini di pagamento e spedizione:

Quantità di ordine minimo:	1000 pezzi
Prezzo:	0.1-10 USD/PCS
Imballaggi particolari:	Cartone da 241312 cm
Tempi di consegna:	3-8 giorni lavorativi
Termini di pagamento:	T/T
Capacità di alimentazione:	100.000 pezzi/mese

Contatto

Descrizione di prodotto dettagliata

Nome dei prodotti:	Cuscinetto termico CPU a trasferimento di calore con cuscinetto termico conduttivo da 3,0 W MK adatt	Numero di parte:	TIF100-32-05S
Durezza:	65/45 Shore 00	Conducibilità termica:	3.2W/mK
Parole chiave:	Pad termico della CPU	Colore:	Blu
Spessore:	0,010~0,200 pollici(0,25mm~5,0mm)	campione:	gratuito
Costruzione:	Elastomero siliconico caricato con ceramica

Heat Transfer CPU Thermal Pad With 3.2W/MK Thermal Conductive Gap Pad Suitable For Portable Electronics And Industrial Equipment

Company Profile

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

Products description

TIF^®100-32-05S Series is awell-balanced,general-purpose thermal pad.It offers good thermal conductivity_and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use,making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components.It is an ideal choice for addressing medium to high power heat dissipation needs, achieving the best balance between cost and performance.

Features

> Good thermal conductive: 3.2W/mK

> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses
> Broad range of hardnesses available

Applications

> Power tools
> Network communication products
> Electric vehicle batteries
> Computer CPU/GPU Cooling
> New energy vehicle power systems

Key attributes

Typical Properties of TIF^®100-32-05S Series
Property	Value		Test method
Color	Blue		Visual
Construction & Compostion	Ceramic filled silicone elastomer		******
Density(g/cm³)	3.0		ASTM D792
Thickness Range(inch/mm)	0.010~0.020	0.030~0.200	ASTM D374
	(0.25~0.50)	(0.75~5.00)
Hardness	65 Shore 00	45 Shore 00	ASTM 2240
Recommended Operating Temperature	-40 to 200℃		******
Breakdown Voltage(V/mm)	≥5500		ASTM D149
Dielectric Constant @1MHz	6.0		ASTM D150
Volume Resistivity(Ohm-meter)	＞1.0X10¹²		ASTM D257
Flame rating	V-0		UL 94 (E331100)
Thermal conductivity (W/m-K)	3.2		ASTM D5470
	3.2		ISO22007

Product Specifications

Standard Thickness:0.010" (0.25 mm)～0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16" X16" (406 mm X406 mm).

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF^®series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Heat Transfer CPU Thermal Pad With 3.2W/MK Thermal Conductive Gap Pad Suitable For Portable Electronics And Industrial Equipment 0

Our services

Online-service : 12 hours , Inquiry reply within fastest.

Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

FAQ:

Q: What thermal conductivity test method was used to achieve the values given on the data sheets?

A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.

Q: Is GAP PAD offered with an adhesive?

A: Currently, Most of thermal gap pad surface has double side natural inherent tack,Non-stick surface can also be treated according to customer's requirements.

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

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