logo
Casa ProdottiCuscinetto termico del CPU

Thermal Gap Filler Designed To Provide Thermal Conductivity Of 2.0W/mK For Electronics Cooling Applications

Thermal Gap Filler Designed To Provide Thermal Conductivity Of 2.0W/mK For Electronics Cooling Applications

Dettagli:
Luogo di origine: Cina
Marca: Ziitek
Certificazione: UL and RoHs
Numero di modello: TIF100-20-10E
Documento: TIF100-20-10E_Data Sheet.pdf
Termini di pagamento e spedizione:
Quantità di ordine minimo: 1000 pezzi
Prezzo: 0.1-10 USD/PCS
Imballaggi particolari: Cartone da 24*13*12 cm
Tempi di consegna: 3-8 giorni lavorativi
Termini di pagamento: T/T
Capacità di alimentazione: 100.000 pezzi/mese
Contatto
Descrizione di prodotto dettagliata
Nome dei prodotti: Riempitore di gap termico progettato per fornire una conduttività termica di 2,0 W/mK per applicazio conduttivo termico: 2,0 W/mK
Durezza: 65/35 Shore 00 campione: Campione gratuito
Colore: Grigio Spessore: 0,010 "(0,25 mm) ~ 0,200" (5,0 mm)
Densità: 20,7 g/cm3 Parole chiave: Riempitivo di gap termico
Costruzione: Elastomero siliconico caricato con ceramica Applicazione: Applicazione di raffreddamento dell'elettronica

Thermal Gap Filler Designed To Provide Thermal Conductivity Of 2.0W/mK For Electronics Cooling Applications

Products description


The TIF®100-15-01F Series is a structurally supportive thermal pad designed to provide good heat dissipation while also ensuring structural support and durability. It can reliably fillinterfacegaps,transfer heat,and offer mechanical support for stacked components, resisting compressive deformation. This product is an ideal choice for applications that require a balance between heat dissipation,insulation,
and mechanical stability.


Features 

> Good thermal conductivity
> Good softness and fillability
> Self-adhesive without the need for additional surface adhesive
> Good insulation performance

Applications 

> Photovoltaic
> Signal communication
> New energy vehicle
> Motherboard chip
> Radiator
> AI Processors AI Servers
> Home appliance industry
> Power module
> Wearable device
> Solar photovoltaic panel
> LED lighting fixtures

Key attributes 


Typical Properties of TIF®100-20-10E Series
Property Value Test method
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 2.7 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.00)
Hardness (Shore 00) 65 35 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant @1MHz 5.0 ASTM D150
Volume Resistivity(Ohm-meter) >1.0X1012  ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity(W/m-K) 2.0 ASTM D5470
2.0 ISO22007

 

Product Specifications 


Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16" X16" (406 mm X406 mm).


Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).


The TIF®series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

 

Thermal Gap Filler Designed To Provide Thermal Conductivity Of 2.0W/mK For Electronics Cooling Applications 0


Packaging Details & Lead time 


The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Thermal Gap Filler Offering Superior Softness and Thermal Conductivity to Enhance Cooling and Reliability of Electronic Assemblies 1

Company profile 


Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.


Factory Size:8000~10,000 square meters

Factory Country/Region:No.12, Xiju Road, Hengli Township, Dongguan City, Guangdong Province, P.R.China

Online-service : 12 hours , Inquiry reply within fastest.
Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).


Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples


After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

 

Why Choose us ? 

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.

 

Thermal Gap Filler Offering Superior Softness and Thermal Conductivity to Enhance Cooling and Reliability of Electronic Assemblies 2

Dettagli di contatto
Dongguan Ziitek Electronical Material and Technology Ltd.

Persona di contatto: Dana Dai

Telefono: +86 18153789196

Invia la tua richiesta direttamente a noi (0 / 3000)

Altri prodotti