Il cuscinetto conduttivo termico è guardante e lavorante molto buon. Ora non abbiamo esigenza dell'altro cuscinetto conduttivo termico!
—— Peter Gay
Avevo cooperato con Ziitek per 2 anni, hanno fornito i materiali conduttivi termici di alta qualità e la consegna a tempo, raccomanda i loro materiali a cambiamento di fase
—— Antonello SAU
Buona qualità, buon servizio. Il vostro gruppo sempre darci l'aiuto e la risoluzione, spera che siamo buon partner continuamente!
White 1.2W/mK Two Compound Thermally Conductive Potting Compound for Electronic Component TIS™680-12AB Series is a two-part silicone potting adhesive with high thermal conductivity, room temperature curable... Leggi di più
Low Shrinkage One Component Thermal Epoxy Glue For Electronic Product Encapsulation TIE®380-45 is a single-component heat-curable modified epoxy resin adhesive containing high-purity thermally conductive ... Leggi di più
High Thermal Conductivity Two-Component Epoxy Resin Thermal Conductivity Potting Adhesive For Power Supply TIE®280-15AB is a two-component epoxy resin sealantwithgood thermal conductivity and room temperature ... Leggi di più
Two Components 1.0W/MK Thermally Conductive Potting Compound For 5G Base Station & Infrastructure Product Description TIS ®680-10AB is a two-component potting adhesive. When Component A and Component B are ... Leggi di più
3.5W/mK Silicone Thermally Conductive Potting Two Parts Fire Resistant LED Lighting Potting TIS™680-35AB is a two-component, high thermal conductive, low temperature cured, long pot life , fire resistant Silica ... Leggi di più
3.0 W/MK Thermally Conductive Silicone Thermal Pad With12 Shore 00 For Micro Heat Pipe Thermal Solutions Company Profile Dongguan Ziitek Electronic Material and Technology Ltd. (ZIITEK) has been deeply involved ... Leggi di più
CPU Thermal Pad High Thermal Conductive Material For Heat Transfer In Electronic Devices And Telecommunication Equipment Company Profile Ziitek Electronic Material and Technology Ltd(ZIITEK) has been deeply ... Leggi di più
4.5W/MK Thermal Conductive glue Material Conductive Epoxy Resin Potting Compound adhesive Gel Low Thermal Resistance TIE®380-45 is a single-component heat-curable modified epoxy resin adhesive containing high... Leggi di più
Two-Component 2.5W/MK Exoxy Resin Thermal Conductive Glue For Automotive Starters Potting Products description TIE®280-25AB is a two-component epoxy resin sealantwithgood thermal conductivity and room ... Leggi di più