Il cuscinetto conduttivo termico è guardante e lavorante molto buon. Ora non abbiamo esigenza dell'altro cuscinetto conduttivo termico!
—— Peter Gay
Avevo cooperato con Ziitek per 2 anni, hanno fornito i materiali conduttivi termici di alta qualità e la consegna a tempo, raccomanda i loro materiali a cambiamento di fase
—— Antonello SAU
Buona qualità, buon servizio. Il vostro gruppo sempre darci l'aiuto e la risoluzione, spera che siamo buon partner continuamente!
Thermal Conductive CPU Thermal Pad With 5.0W/MK Gap Pad Material Suitable For Portable Electronics Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of ... Leggi di più
China company supplied and professional CPU thermal pad TIF500-50-11S with grey color for various electronic device Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, ... Leggi di più
High performance low cost CPU thermal pad TIF5160US with violet color for various electronic device The TIF5160US is an electrically isolating material, which allows its use in applications requiring isolation ... Leggi di più
good performance CPU thermal pad TIF5200US with Violet color for various electronic device The TIF5200US is an electrically isolating material, which allows its use in applications requiring isolation between ... Leggi di più
4.5mm mainboard/mother board Applicated Soft thermal conductive gap pad 5.0W/M-K 45shore00 Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the ... Leggi di più
5.0mm mainboard/mother board Applicated Soft thermal conductive gap pad 5.0W/M-K 45shore00 Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the ... Leggi di più
1.0mmT grey Micro heat pipe thermal solutions applied Thermal Gap Filler Pad 4.0W/MK 20 Shore 00 TIF540-40-11US Series thermally conductive interface materials are applied to fill the air gaps between the ... Leggi di più
20 Shore 00 LED Power Supply applied 2.5mmT ultra soft thermal gap pad Pad 4.0W/MK TIF5100-40-11US Series thermally conductive interface materials are applied to fill the air gaps between the heating elements ... Leggi di più
4.0W/MK 20 Shore 00 Telecommunication hardware applied 3.0mmT ultra soft thermal gap pad TIF5120-40-11US Series thermally conductive interface materials are applied to fill the air gaps between the heating ... Leggi di più
4.0W/mK RoHS compliant, new developed thermally conductive silicone rubber 5.0mmT, 20 Shore 00 for CPU TIF5200-40-11US Series thermally conductive interface materials are applied to fill the air gaps between ... Leggi di più