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Thermal Conductive Pad 2.0W/mK Thermal Conductivity Material With Natural Tackiness For Application In Electronic Cooling

Thermal Conductive Pad 2.0W/mK Thermal Conductivity Material With Natural Tackiness For Application In Electronic Cooling

Dettagli:
Luogo di origine: Cina
Marca: Ziitek
Certificazione: UL
Numero di modello: TIF100-20-02S
Documento: TIF100-20-02S_Data Sheet.pdf
Termini di pagamento e spedizione:
Quantità di ordine minimo: 1000 pezzi
Prezzo: 0.1-10 USD/PCS
Imballaggi particolari: Scatole da 24*13*12 cm
Tempi di consegna: 3-8 giorni lavorativi
Termini di pagamento: T/T
Capacità di alimentazione: 100.000 pezzi/mese
Contatto
Descrizione di prodotto dettagliata
Nome dei prodotti: Cuscinetto termoconduttivo Materiale con conduttività termica da 2,0 W/mK con appiccicosità naturale Durezza: 65/45shore 00
Parole chiave: Cuscinetto conduttivo termico Colore: bianco grigio
Conducibilità termica: 2.0W/mk Applicazione: Per applicazioni nel raffreddamento elettronico
Costruzione: Elastomero siliconico caricato con ceramica Spessore: 0,010~0,200"(0,25~5,0 mm)
Campione: Gratuito

Thermal Conductive Pad 2.0W/mK Thermal Conductivity Material With Natural Tackiness For Application In Electronic Cooling
Product Overview

TIF®100-20-02S Series is a well-balanced, general-purpose thermal pad. It offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components.

Key Features
  • Good thermal conductivity
  • Ultra-soft and highly conformable
  • Self-adhesive without the need for additional surface adhesive
  • Good insulation performance
Applications
  • Home appliance industry
  • Power module
  • Wearable devices
  • Solar photovoltaic panels
  • LED lighting fixtures
  • Routers
  • Medical devices
  • Audio electronic products
  • Unmanned aerial vehicles (UAV)
  • Photovoltaic systems
  • Signal communication
  • New energy vehicles
  • Motherboard chip
  • Radiator
  • AI Processors AI Servers
Technical Specifications of TIF®100-20-02S Series
Property Value Test Method
Color Gray white Visual
Construction Ceramic filled silicone elastomer ******
Density (g/cm³) 2.65 ASTM D792
Thickness Range (inch/mm) 0.010~0.020 (0.25~0.50)
0.030~0.200 (0.75~5.00)
ASTM D374
Hardness (Shore 00) 65 | 45 ASTM 2240
Recommended Operating Temperature (℃) -40 to 200℃ ***
Breakdown Voltage (V/mm) ≥5500 ASTM D149
Dielectric Constant @1MHz 4.7 ASTM D150
Volume Resistivity >1.0×10¹² Ohm-meter ASTM D257
Thermal Conductivity (W/m-K) 2.0 ASTM D5470
ISO22007
Fire rating V-0 UL 94 (E331100)
Product Specifications

Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)

Standard Size: 16"×16" (406 mm×406 mm)

Component Codes:
Reinforcement Fabric: FG (Fiberglass)
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)

The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

TIF®100-20-02S Series Thermal Conductive Pad product photo
Company Advantages
  • Our value message is "Do it right the First time, total quality control"
  • Our core competency is thermal conductive interface materials
  • Competitive advantage products
  • Confidentiality agreement and Business Secret Contract
  • Free sample offer
  • Quality assurance contract
Frequently Asked Questions
Q: Do you accept custom orders?
A: Yes, we welcome custom orders. Our customization options include dimensions, shape, color, and coating on one or both sides with adhesive or fiberglass. To place a custom order, please provide a drawing or detailed specifications.
Q: How do I request customized samples?
A: To request samples, you can leave us a message on our website, or contact us via email or phone.
Q: What's the thermal conductivity test method given on the data sheet?
A: All data in the sheet are actual tested results. Hot Disk and ASTM D5470 methods are utilized to test thermal conductivity.

Dettagli di contatto
Dongguan Ziitek Electronical Material and Technology Ltd.

Persona di contatto: Dana Dai

Telefono: +86 18153789196

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