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Good Heat Dissipation Ultra Soft 7.5W Silicone Thermal Pad For AI Processors AI Servers

Good Heat Dissipation Ultra Soft 7.5W Silicone Thermal Pad For AI Processors AI Servers

Dettagli:
Luogo di origine: Cina
Marca: Ziitek
Certificazione: UL & RoHS
Numero di modello: TIF700PUS
Termini di pagamento e spedizione:
Quantità di ordine minimo: 1000 pezzi
Prezzo: 0.1-10 USD/PCS
Imballaggi particolari: Scatole da 24*23*12 cm
Tempi di consegna: 3-5 giorni lavorativi
Termini di pagamento: T/T
Capacità di alimentazione: 1000000 pezzi/mese
Contatto
Descrizione di prodotto dettagliata
Nome dei prodotti: Pad termico in silicone ultra morbido da 7,5 W con buona dissipazione del calore per processori AI S Costruzione: Elastomero in silicone pieno di ceramica
Applicazione: Server AI Processori AI Intervallo di spessore: 0,5-5,0 mmT
Valutazione del fuoco: UL94 V-0 Costante dielettrica @1MHz: 4.5
Colore: Grigio Conducibilità termica: 7.5W/m-K
Tensione di rottura (V/mm)): ≥5500 Parole chiave: cuscinetto termico del silicone

Good Heat Dissipation Ultra Soft 7.5W Silicone Thermal Pad For AI Processors AI Servers

 

 Company Profile

 

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 

The TIF®700PUS Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. It is suitable for addressing issues in high-precision assemblies, such as large tolerances, uneven surfaces, and the susceptibility of delicate components to mechanical damage.

Features

> Excellent thermal conductivity:7.5 W/mK
> Super soft and highly compliant
> Self-adhesive without the need for additional surface adhesives
> High insulation performance

Applications

> Al Servers
> Semiconductor Packaging
> Low-Altitude Aircraft
> Optical Communication Products
> 5G Base Stations
> Unmanned aerial vehicle(UAV)
> Photovoltaic
> Signal communication
> New energy vehicle
> Motherboard chip
> Radiator
 
Typical Properties of TIF®700PUS Series
Property Value Test method
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.2 ASTM D792
Thickness Range(inch/mm)

0.020~0.030

(0.50~0.5)

0.040~0.200 (1.0~5.0) ASTM D374
Hardness (Shore OO) 70 20 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ***
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 4.5 MHz ASTM D150
Volume Resistivity >3.5 X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 7.5 W/m-K ASTM D5470
7.5 W/m-K ISO22007

 

Product Specifications

Standard Thickness:0.020" (0.50 mm)~0.200" (5.00 mm) with increments of 0.01" (0.25 mm)
Standard Size: 16"X 16" (406 mmX406 mm)

Component Codes:
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

 

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Good Heat Dissipation Ultra Soft 7.5W Silicone Thermal Pad For AI Processors AI Servers 0

Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.

 

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

 

Dettagli di contatto
Dongguan Ziitek Electronical Material and Technology Ltd.

Persona di contatto: Dana Dai

Telefono: +86 18153789196

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