Brief: Discover the new type manufactured insulation silicone thermal pad, TIF220-01U Series, designed for high-speed mass storage drives. This advanced thermal pad offers excellent heat transfer, insulation, and damping properties, perfect for miniaturized and ultra-thin designs. Learn more about its features and applications in this video.
Related Product Features:
Buona conducibilità termica di 1,25 W/mK per un efficiente trasferimento di calore.
Disponibile in vari spessori da 0,010" a 0,200" per adattarsi a diverse applicazioni.
UL recognized and compliant with UL94 V-0, SGS, and ROHS standards.
High tack surface reduces contact resistance for better performance.
Ceramic-filled silicone elastomer construction ensures durability and reliability.
Broad range of hardnesses available to meet specific requirements.
Suitable for applications like LED TVs, CPUs, memory modules, and telecommunication hardware.
Can be customized with pressure-sensitive adhesive on one or both sides.
Domande frequenti:
Qual è la conduttività termica del pad termico della serie TIF220-01U?
Il pad termico della serie TIF220-01U ha una conducibilità termica di 1,25 W/mK, garantendo un efficiente trasferimento di calore.
What standards does the TIF220-01U Series comply with?
The TIF220-01U Series is UL recognized and complies with UL94 V-0, SGS, and ROHS standards.
Can the TIF220-01U Series thermal pad be customized with adhesive?
Yes, the TIF220-01U Series can be customized with pressure-sensitive adhesive on one side (A1 suffix) or both sides (A2 suffix) upon request.