Brief: Discover the TIC™800P Series PCM Phase Change Material, designed for communications equipment and wireless stations. This pink thermal interface material softens at 50℃, reducing thermal resistance with no performance degradation after 1,000 hours at 130℃. Ideal for CPUs, display cards, and more.
Related Product Features:
Low melting point thermal interface material that softens at 50℃ to fill microscopic irregularities.
Solido flessibile a temperatura ambiente senza componenti di rinforzo per prestazioni termiche ottimali.
Nessuna degradazione delle prestazioni termiche dopo 1.000 ore a 130℃ o 500 cicli da -25℃ a 125℃.
Naturally tacky at room temperature, eliminating the need for adhesives.
Thermal resistance of 0.024℃-in²/W for efficient heat dissipation.
Disponibile in spessori standard di 0,005", 0,008", e 0,010".
Suitable for applications like CPUs, display cards, and power supplies.
Comes with white release paper and bottom liner for easy handling.
Domande frequenti:
Qual è la temperatura di rammollimento della serie TIC™800P?
La Serie TIC™800P inizia ad ammorbidirsi a 50℃, permettendole di riempire le irregolarità microscopiche per una ridotta resistenza termica.
Does the TIC™800P Series require adhesives?
No, the material is naturally tacky at room temperature, so no adhesives are required.
What are the typical applications for the TIC™800P Series?
The TIC™800P Series is ideal for CPUs, display cards, mainboards, notebooks, power supplies, heat pipe thermal solutions, memory modules, and mass storage devices.