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3.0W/mK Thermally Conductive Silicone Thermal Pad With Good Softness And Fillability For AI Processors And Electronics Cooling

3.0W/mK Thermally Conductive Silicone Thermal Pad With Good Softness And Fillability For AI Processors And Electronics Cooling

Dettagli:
Luogo di origine: Cina
Marca: Ziitek
Certificazione: UL and RoHs
Numero di modello: TIF100-30-06S
Documento: TIF100-30-06S_Data Sheet.pdf
Termini di pagamento e spedizione:
Quantità di ordine minimo: 1000 pezzi
Prezzo: 0.1-10 USD/PCS
Imballaggi particolari: Cartone da 24*13*12 cm
Tempi di consegna: 3-8 giorni lavorativi
Termini di pagamento: T/T
Capacità di alimentazione: 100.000 pezzi/mese
Contatto
Descrizione di prodotto dettagliata
Nome dei prodotti: Cuscinetto termico in silicone termicamente conduttivo da 3,0 W/mK con buona morbidezza e riempibili conduttivo termico: 3.0W/mK
Durezza: 65/45 Shore 00 campione: Campione gratuito
Colore: bianco Spessore: 0,010"~0,200"/(0,25~5,0 mm)
Densità: 30,0 g/cm3 Parole chiave: Cuscinetto termico in silicone
Costruzione: Elastomero siliconico caricato con ceramica Applicazione: Processori AI e raffreddamento dell'elettronica

3.0W/mK Thermally Conductive Silicone Thermal Pad With Good Softness And Fillability For AI Processors And Electronics Cooling

Products description


The TIF®100-30-06S Series is awell-balanced,general-purpose thermal pad.It offers high thermal conductivity and moderate hardness. This balanced design provides both excellent suface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. It is an ideal choice for addressing medium to high power heat dissipation needs, achieving the best balance between cost and performance.


Features 

> Good thermal conductive 3.0W/mK
> Good softness and fillability
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance

Applications 

> Photovoltaic
> Signal communication
> New energy vehicle
> Motherboard chip
> Radiator
> AI Processors AI Servers
> Semiconductor Packaging
> Low-Altitude Aircraft
> Optical Communication Products
> 5G Base Stations
> Electric vehicle batteries
> Computer CPU/GPU Cooling
> New energy vehicle power systems

Key attributes 


Typical Properties of TIF®100-30-06S Series
Property Value Test method
Color White Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.0 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.0)
Hardness (Shroe 00) 65 45 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant@ 1MHz 5.2 ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 3.0 W/m-K ASTM D5470
3.0 W/m-K ISO22007

 

Product Specifications 


Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"X16" (406 mmX406 mm)

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF® series is available in customshapes and various forms.
For other thicknesses or more information,please contact us.

3.0W/mK Thermally Conductive Silicone Thermal Pad With Good Softness And Fillability For AI Processors And Electronics Cooling 0


Packaging Details & Lead time 


The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Thermal Gap Filler Offering Superior Softness and Thermal Conductivity to Enhance Cooling and Reliability of Electronic Assemblies 1

Company profile 


Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.


Factory Size:8000~10,000 square meters

Factory Country/Region:No.12, Xiju Road, Hengli Township, Dongguan City, Guangdong Province, P.R.China

Online-service : 12 hours , Inquiry reply within fastest.
Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).


Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples


After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.


Ziitek Culture


Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete  teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

Thermal Gap Filler Offering Superior Softness and Thermal Conductivity to Enhance Cooling and Reliability of Electronic Assemblies 2

Dettagli di contatto
Dongguan Ziitek Electronical Material and Technology Ltd.

Persona di contatto: Dana Dai

Telefono: +86 18153789196

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