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Low Compression Stress 6.5W Soft Thermal GAP PAD Materials For AI Processors AI Servers

Low Compression Stress 6.5W Soft Thermal GAP PAD Materials For AI Processors AI Servers

Dettagli:
Luogo di origine: Cina
Marca: Ziitek
Certificazione: UL & RoHS
Numero di modello: TIF700NS
Termini di pagamento e spedizione:
Quantità di ordine minimo: 1000 pezzi
Prezzo: 0.1-10 USD/PCS
Imballaggi particolari: Scatole da 24*13*12 cm
Tempi di consegna: 3-5 giorni lavorativi
Termini di pagamento: T/T
Capacità di alimentazione: 1000000 pezzi/mese
Contatto
Descrizione di prodotto dettagliata
Nome dei prodotti: Materiali GAP PAD termici morbidi da 6,5 ​​W a basso stress di compressione per processori AI Server Colore: grigio
Durezza: 65/45 Shore 00 Conducibilità termica (w/mk): 6.5
Densità (g/cm³): 3.4 Parole chiave: Pad di spaziamento termico
Intervallo di spessore: 0,010"~0,200"(0,25mm~5,0mm) Applicazione: Processori AI Server AI

Low Compression Stress 6.5W Soft Thermal GAP PAD Materials For AI Processors AI Servers

 

Company Profile

 

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

 

The TIF®700NS Series a well-balanced, general-purpose thermal pad. It offers excellent thermal conductivity and moderate hardness. This balanced design provides both good surface conformity and excellent ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. It is an ideal choice for addressing medium to high power heat dissipation needs, achieving the best balance between cost and performance.

 

Features

 

> Good thermal conductive
> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses

 

Applications


Electronic Components – 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robotics, Servers, Smart Home, Telecom, etc.

 

Typical Properties of TIF®700NS Series
Property Value Test method
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.4 ASTM D792
Thickness Range(inch/mm) 0.010~0.030 0.040~0.200 ASTM D374
(0.25~0.75) (1.0~5.00)
Hardness 60 Shore 00 45 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 7.0 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 6.5 W/m-K ASTM D5470
6.5 W/m-K ISO22007

 

Product Specification


Product Thicknesses: 0.010"(0.25mm)~ 0.200" (5.00mm) with increments of 0.010"(0.25mm).
Product Sizes: 16" x 16" (406mm x 406mm)

 

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

 

The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Low Compression Stress 6.5W Soft Thermal GAP PAD Materials For AI Processors AI Servers 0

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

 

FAQ:

 

Q: What thermal conductivity test method was used to achieve the values given on the data sheets?

A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.

 

Q: Is GAP PAD offered with an adhesive?

A: Currently, Most of thermal gap pad surface has double side natural inherent tack,Non-stick surface can also be treated according to customer's requirements.

 

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

 

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

 

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

Dettagli di contatto
Dongguan Ziitek Electronical Material and Technology Ltd.

Persona di contatto: Dana Dai

Telefono: +86 18153789196

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